Diffusion bonding of a Cu-Cr-Zr alloy to stainless steel and tungsten using nickel as an interlayer

被引：58
作者：
Batra, IS [1 ]
Kale, GB
Saha, TK
Ray, AK
Derose, J
Krishnan, J
机构：
[1] Bhabha Atom Res Ctr, Div Mat Sci, Bombay 400085, Maharashtra, India
[2] Bhabha Atom Res Ctr, Div Laser & Plasma Technol, Bombay 400085, Maharashtra, India
[3] Bhabha Atom Res Ctr, Ctr Design & Mfg, Bombay 400085, Maharashtra, India
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 369卷 / 1-2期
关键词：
diffusion bonding; Cu-Cr-Zr alloy; tungsten; stainless steel; EPMA;
D O I：
10.1016/j.msea.2003.10.296
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that of the sintered tungsten used in this work. (C) 2003 Elsevier B.V. All rights reserved.
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页码：119 / 123
页数：5
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