Boundary integral equations for 2D thermoelectroelasticity of a half-space with cracks and thin inclusions

The paper presents a rigorous and straightforward approach for obtaining the 2D boundary integral equations for a thermoelectroelastic half-space containing holes, cracks and thin foreign inclusions. It starts from the Cauchy integral formula and Stroh orthogonality relations to obtain the integral formulae for the Stroh complex functions, which are piecewise-analytic in the complex half-plane with holes and opened mathematical cuts. Further application of the Stroh formalism allows derivation of the Somigliana type integral formulae and boundary integral equations for a thermoelectroelastic half-space. The kernels of these equations correspond to the fundamental solutions of heat transfer, electroelasticity and thermoelectroelasticity for a half-space. It is shown that the difference between the obtained fundamental solution of thermoelectroelasticity and those presented in literature is due to the fact, that present solution additionally accounts for extended displacement and stress continuity conditions, thus, it is physically correct. Obtained integral equations are introduced into the boundary element approach. Numerical examples validate derived boundary integral equations, show their efficiency and accuracy. (C) 2013 Elsevier Ltd. All rights reserved.