mixed signal VLSI circuit;
substrate crosstalk;
power integrity;
substrate network model;
SIGNAL INTEGRATED-CIRCUITS;
NOISE;
DESIGN;
ICS;
D O I:
10.1587/transele.E96.C.875
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Substrate coupling of radio frequency (RF) components is represented by equivalent circuits unifying a resistive mesh network with lumped capacitors in connection with the backside of device models. Two-port S-parameter test structures are used to characterize the strength of substrate coupling of resistors, capacitors, inductors, and MOSFETs in a 65 nm CMOS technology with different geometries and dimensions. The consistency is finely demonstrated between simulation with the equivalent circuits and measurements of the test structures, with the deviation of typically less than 3 dB for passive and 6 dB for active components, in the transmission properties for the frequency range of interest up to 8 GHz.