Thermosonic wire bonding of gold wire onto copper pad using the saturated interfacial phenomena

Copper has been used to replace conventional aluminium interconnection to improve the performance of deep submicron integrated circuits. This study used the saturated interfacial phenomena found in thermosonic ball bonding of gold wire onto aluminium pad to investigate thermosonic ball bonding of gold wire onto copper pad. The effects of preheat temperatures and ultrasonic powers on the bonding force were investigated by using a thermosonic bonding machine and a shear tester. This work shows that under proper preheat temperatures, the bonding force of thermosonic wire bonding can be explained based on interfacial microcontact phenomena such as energy intensity, interfacial temperature and real contact area. It is clearly shown that as the energy intensity is increased, the shear force increases, reaches a maximum, and then decreases. After saturation, i.e. the establishment of maximum atomic bonding, any type of additional energy input will damage the bonding, decreasing the shear force. If the preheat temperature is not within the toper range, the interfacial saturation p phenomenon does not exist. For a preload of 0.5 N and a welding time of 15 ms in thermosonic wire bonding of gold wire onto copper pads, a maximum shear force of about 0.33 N is found where the interfacial energy intensity equals 1.8 x 10(6) J m(-2) for preheat temperatures of 150degreesC and 170degreesC. Moreover, the corresponding optimal ultrasonic power is about 110 units.