Simple fabrication scheme for sub-10 nm electrode gaps using electron-beam lithography

被引:151
|
作者
Liu, K
Avouris, P
Bucchignano, J
Martel, R
Sun, S
Michl, J
机构
[1] IBM Res Div, TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] Univ Colorado, Dept Chem & Biochem, Boulder, CO 80329 USA
关键词
D O I
10.1063/1.1436275
中图分类号
O59 [应用物理学];
学科分类号
摘要
An innovative and simple method, based on electron-beam (e-beam) overlapping and overexposure techniques, is developed to fabricate sub-10 nm electrode gaps with very good electrical properties. Gaps with 4 to 10 nm spacing can be fabricated using a proper e-beam dose and pattern-developing time. The fabrication yield is nearly 100% for 8-9 nm gaps, but significantly smaller for 3-4 nm gaps. The gap leakage resistance is around 10(12)-10(13) Omega, implying very good isolation. As an example, we present a transport study on a single 8 nm Co particle junction using a 10 nm gap. (C) 2002 American Institute of Physics.
引用
收藏
页码:865 / 867
页数:3
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