Thermal conductive polymers

被引:2
|
作者
Amesöder, S [1 ]
Ehrenstein, GW [1 ]
机构
[1] Univ Erlangen Nurnberg, Lehrstuhl Kunststonfftech, D-91058 Erlangen, Germany
来源
ZEITSCHRIFT FUR METALLKUNDE | 2003年 / 94卷 / 05期
关键词
high filled polymers; polymer compounds; thermal conductivity; injection molding; measurements;
D O I
10.3139/146.030606
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
The potential and significant influences of thermal conductive optimised thermoplastic polymers have been investigated. Using new polymer compounds with a high content of metal or ceramic filler, besides of several mechanical features of a part, it is also possible to integrate additional electric, magnetic or thermal functionalities. The increase of the thermal conductivity by controlled addition of metal or ceramic fillers is an innovative approach for direct adjustment of a plastic part's heat transport performance. To achieve a thermal conductivity that is of technical interest, a filler content of at least 60 vol.% is necessary. Besides of the filler content, important factors of influence are the thermal conductivity of the filler itself and the shape of the filler particles. When compared with globular copper particles, using filler particles with anisotropic shape, e. g. copper flakes with a high aspect ratio, it is possible to increase the thermal conductivity significantly. In the case of anisotropic fillers, orientations that result form the injections molding process lead to a higher thermal conductivity in the direction of the orientation, where the differences are of serious practical concern.
引用
收藏
页码:606 / 609
页数:4
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