Determination of copper nanoparticle size distributions with total reflection X-ray fluorescence spectroscopy

被引:7
作者
Singh, Andy [1 ]
Luening, Katharina [1 ]
Brennan, Sean [1 ]
Homma, Takayuki [2 ]
Kubo, Nobuhiro [2 ]
Nowak, Stanislaw H. [1 ]
Pianetta, Piero [1 ]
机构
[1] Stanford Synchrotron Radiat Lab, 2575 Sand Hill Rd, Menlo Pk, CA 94025 USA
[2] Waseda Univ, Dept Appl Chem, Shinjuku Ku, Tokyo 1698555, Japan
基金
瑞士国家科学基金会;
关键词
silicon wafer surface; total reflection X-ray fluorescence; Cu nanoparticle; grazing-incidence X-ray fluorescence; SILICON-WAFER SURFACES; SYNCHROTRON-RADIATION; DISSOLVED-OXYGEN; GRAZING-INCIDENCE; ULTRAPURE WATER; NATIVE-OXIDE; IMPLANTS; GROWTH;
D O I
10.1107/S1600577516015484
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Total reflection X-ray fluorescence (TXRF) analysis is extensively used by the semiconductor industry for measuring trace metal contamination on silicon surfaces. In addition to determining the quantity of impurities on a surface, TXRF can reveal information about the vertical distribution of contaminants by measuring the fluorescence signal as a function of the angle of incidence. In this study, two samples were intentionally contaminated with copper in non-deoxygenated and deoxygenated ultrapure water (UPW) resulting in impurity profiles that were either atomically dispersed in a thin film or particle-like, respectively. The concentration profile of the samples immersed into deoxygenated UPW was calculated using a theoretical concentration profile representative of particles, yielding a mean particle height of 16.1 nm. However, the resulting theoretical profile suggested that a distribution of particle heights exists on the surface. The fit of the angular distribution data was further refined by minimizing the residual error of a least-squares fit employing a model with a Gaussian distribution of particle heights about the mean height. The presence of a height distribution was also confirmed with atomic force microscopy measurements.
引用
收藏
页码:283 / 287
页数:5
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