AlGaN/SiC Heterojunction Bipolar Transistors Featuring AlN/GaN Short-Period Superlattice Emitter

被引:5
作者
Miyake, Hiroki [1 ]
Kimoto, Tsunenobu [1 ,2 ]
Suda, Jun [1 ]
机构
[1] Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan
[2] Kyoto Univ, Photon & Elect Sci & Engn Ctr, Kyoto 6158510, Japan
基金
日本学术振兴会;
关键词
Aluminum gallium nitride (AlGaN); band offset; current gain; heterojunction bipolar transistor (HBT); molecular beam epitaxy (MBE); silicon carbide (SiC); superlattice; N-P HETEROJUNCTIONS; LOW V-CESAT; CURRENT GAIN; 4H-SIC BJTS; SIC BJTS; JUNCTION TRANSISTORS; GAN FILMS; DIODES; CAPABILITY; EPITAXY;
D O I
10.1109/TED.2013.2273499
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Growth and electrical characterization of aluminum gallium nitride (AlGaN)/SiC heterojunction bipolar transistors (HBTs) featuring AlN/GaN short-period superlattice as a quasi-AlGaN emitter are presented. The AlN/GaN superlattice emitter was grown by molecular beam epitaxy on off-axis SiC, which showed adequate structural and electronic properties as the emitter of the HBTs. We investigated the impact of Al composition in the emitter on the transport characteristics and current gain of the HBTs. Using Al composition of over 0.5, we achieved type-I band alignment in AlGaN/SiC, and suppressed the tunneling current via interface traps, resulting in an improved current gain of up to 2.7. Toward further improvement of current gain, we also investigated the effect of n-SiC spacer between n-AlGaN and p-SiC and p-SiC base width. Using 200-nm-thick n-SiC spacer and 250-nm-thick p-SiC base layer, we achieved an improved current gain of 13 owing to the reduced interface and bulk recombination.
引用
收藏
页码:2768 / 2775
页数:8
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