Effects of layer design on the performance of InAs/AlSb/GaSb resonant interband tunneling diodes on GaAs substrates

被引:11
|
作者
Shiralagi, K
Shen, J
Tsui, R
机构
[1] Phoenix Corp. Research Laboratories, Motorola, Inc., M/S-EL308, Tempe, AZ 85284
[2] Dept. of Electrical Engineering, Arizona State University, Tempe
关键词
chemical beam epitaxy (CBE); dislocations; interfaces; peak-to-valley current ratio (PVCR); resonant interband tunneling diodes (RITDs);
D O I
10.1007/s11664-997-0060-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The room temperature current-voltage characteristics of InAs/AlSb/GaSb resonant interband tunneling diodes (RITDs), grown by chemical beam epitaxy on GaAs substrates, are reported as a function of the InAs buffer layer thickness and different interface configurations. The peak-to-valley current ratio (PVCR) improved from 1 to 12 as the buffer thickness was increased from 0 to 500 nm and the density of dislocations caused by the lattice mismatch of similar to 7% decreased. No. significant improvement was seen for a buffer thickness beyond 500 nm. Dislocation-free RITDs, grown lattice-matched on InAs substrates, show PVCRs of approximately 16. The InAs/AlSb Interfaces in these structures can be either InSb-like or AZAs-like and the interface can have a very strong effect on the diode performance. Unlike the case in InAs/AlSb field effect transistor structures, an AlAs-like interface results in better PVCRs in the diodes. Details of the results of this study are presented.
引用
收藏
页码:1417 / 1421
页数:5
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