Proton and gamma radiation effects in a new first-generation SiGe HBT technology

被引:26
作者
Haugerud, BM [1 ]
Pratapgarhwala, MM
Comeau, JP
Sutton, AK
Prakash, APG
Cressler, JD
Marshall, PW
Marshall, CJ
Ladbury, RL
El-Diwany, M
Mitchell, C
Rockett, L
Bach, T
Lawrence, R
Haddad, N
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30308 USA
[2] NASA, Goddard Space Flight Ctr, Greenbelt, MD 20771 USA
[3] GSFC, Orbital Sci, Greenbelt, MD 21770 USA
[4] Natl Semicond Corp, Santa Clara, CA 95052 USA
[5] BAE Syst, Manassas, VA 20110 USA
关键词
SiGeHBT; proton; gamma irradiation; circuits; mismatch;
D O I
10.1016/j.sse.2005.11.007
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effects of proton and gamma irradiation on a new commercially available SiGe technology are investigated for the first time. The results of proton irradiation on a differential SiGe HBT LC oscillator are also reported in order to gauge circuit-level impact. These findings indicate that the dc, ac, and RF circuit performance is total dose tolerant up to Mrad-level equivalent total dose. A technology comparison is drawn between the results of this work and the three other previously reported SiGe technologies. We find that all reported SiGe HBT technologies to date show acceptable proton radiation tolerance up to Mrad levels. Transistor mismatch is also investigated here for the first time in SiGe HBTs. Collector current mismatch data as a function of emitter geometry are reported both before and after exposure for this SiGe HBT technology. We find only minimal changes in device-to -device mismatch after radiation exposure, suggesting that these SiGe HBTs should be suitable for use in analog circuits, which are critically dependent on the matching characteristics of the requisite devices. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:181 / 190
页数:10
相关论文
共 21 条
[1]   A SiGe HBT BiCMOS technology for mixed signal RF applications [J].
Ahlgren, DC ;
Freeman, G ;
Subbanna, S ;
Groves, R ;
Greenberg, D ;
Malinowski, J ;
Nguyen-Ngoc, D ;
Jeng, SJ ;
Stein, K ;
Schonenberg, K ;
Kiesling, D ;
Martin, B ;
Wu, S ;
Harame, DL ;
Meyerson, B .
PROCEEDINGS OF THE 1997 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 1997, :195-197
[2]  
[Anonymous], 2003, SILICON GERMANIUM HE
[3]   Anomalous dose rate effects in gamma irradiated SiGe heterojunction bipolar transistors [J].
Banerjee, G ;
Niu, G ;
Cressler, JD ;
Clark, SD ;
Palmer, MJ ;
Ahlgren, DC .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1999, 46 (06) :1620-1626
[4]   Proton tolerance of advanced SiGeHBTs fabricated on different substrate materials [J].
Comeau, JP ;
Sutton, AK ;
Haugerud, BM ;
Cressler, JD ;
Kuo, WML ;
Marshall, PW ;
Reed, RA ;
Karroy, A ;
Van Art, R .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2004, 51 (06) :3743-3747
[5]   SiGe HBT technology: A new contender for Si-based RF and microwave circuit applications [J].
Cressler, JD .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (05) :572-589
[6]   The impact of gamma irradiation on SiGeHBTs operating at cryogenic temperatures [J].
Cressler, JD ;
Krithivasan, R ;
Sutton, AK ;
Seiler, JE ;
Krieg, JF ;
Clark, SD ;
Joseph, AJ .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2003, 50 (06) :1805-1810
[7]   An investigation of the origins of the variable proton tolerance in multiple SiGe HBT BiCMOS technology generations [J].
Cressler, JD ;
Krithivasan, R ;
Zhang, G ;
Niu, GF ;
Marshall, PW ;
Kim, HS ;
Reed, RA ;
Palmer, MJ ;
Joseph, AJ .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2002, 49 (06) :3203-3207
[8]   The effects of proton irradiation on the lateral and vertical scaling of UHV/CVD SiGe HBT BiCMOS technology [J].
Cressler, JD ;
Hamilton, MC ;
Mullinax, GS ;
Li, Y ;
Niu, GF ;
Marshall, CJ ;
Marshall, PW ;
Kim, HS ;
Palmer, MJ ;
Joseph, AJ ;
Freeman, G .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2000, 47 (06) :2515-2520
[9]  
DRENAN P, 2000, P IEEE INT C MICR TE, P122
[10]   Device mismatch in BiCMOS technologies [J].
Drennan, PG .
PROCEEDINGS OF THE 2002 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2002, :104-111