Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films

被引：7

作者：

Chen, Wei-Hsun ^{[1
]}

Wang, Congying ^{[2
]}

Sarobol, Pylin ^{[3
]}

Blendell, John ^{[2
]}

Handwerker, Carol ^{[2
]}

机构：

[1] ASML, 17082 Thornmint Ct, San Diego, CA 92127 USA

[2] Purdue Univ, Sch Mat Engn, 701 West Stadium Ave, W Lafayette, IN 47907 USA

[3] LAM Res, 11155 SW Leveton Dr, Tualatin, OR 97062 USA

来源：

SCRIPTA MATERIALIA | 2020年 / 187卷

基金：

美国国家科学基金会;

关键词：

Synchrotron radiation; Whiskers; Grain boundary sliding; Grain nucleation; Stress relaxation; Fatigue; CRYSTAL ORIENTATION; DAMAGE EVOLUTION; TIN WHISKERS; MICROSTRUCTURE; STRESS; ANISOTROPY; MECHANISM; CU;

D O I：

10.1016/j.scriptamat.2020.06.033

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Two grain boundaries (GBs) in a Sn-alloy film exhibited different morphological changes during thermal cycling: whisker growth and GB sliding. Along GB-I, pervasive nucleation of high-angle and low-angle GBs occurred, with whisker growth of some shallow grains depending on sub-surface GB geometry. Most whiskers showed substantial changes of crystallographic orientation and surface normal relative to the parent grains. Along GB-II, GB sliding was characterized by mass accumulation, crystallographic rotation, and localized yielding. Results for two GBs suggest that grain crystallography and GB geometry, particularly GB inclination, are critical in determining the extent of new grain formation and subsequent whisker growth. (C) 2020 Published by Elsevier Ltd on behalf of Acta Materialia Inc.

引用

页码：458 / 463

页数：6

共 33 条

[1] Anderson P.M., 2017, Theory of Dislocations
[2] Anwar Ali H. P., 2017, Procedia Engineering, V215, P246, DOI 10.1016/j.proeng.2017.12.146
[3] Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25A°C and 0.1/s
Bieler, Thomas R.
Telang, Adwait U.
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) : 2694 - 2701
[4] Whisker and hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits
Boettinger, WJ
Johnson, CE
Bendersky, LA
Moon, KW
Williams, ME
Stafford, GR
[J]. ACTA MATERIALIA, 2005, 53 (19) : 5033 - 5050
[5] Shallow grain formation in Sn thin films
Cai, Xiaorong
Handwerker, Carol A.
Blendell, John E.
Koslowski, Marisol
[J]. ACTA MATERIALIA, 2020, 192 : 1 - 10
[6] Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling
Chen, Wei-Hsun
Sarobol, Pylin
Handwerker, Carol A.
Blendell, John E.
[J]. JOM, 2016, 68 (11) : 2888 - 2899
[7] ACCELERATED GROWTH OF TIN WHISKERS
FISHER, RM
DARKEN, LS
CARROLL, KG
[J]. ACTA METALLURGICA, 1954, 2 (03): : 368 - &
[8] Atomistic simulation of hillock growth
Frolov, T.
Boettinger, W. J.
Mishin, Y.
[J]. ACTA MATERIALIA, 2010, 58 (16) : 5471 - 5480
[9] Goldstein J.I., 2018, Scanning Electron Microscopy and X-Ray Microanalysis, P187, DOI [10.1007/978-1-4939-6676-9_13, DOI 10.1007/978-1-4939-6676-9_13, DOI 10.1007/978-1]
[10] Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction
Hektor, Johan
Micha, Jean-Sebastien
Hall, Stephen A.
Iyengar, Srinivasan
Ristinmaa, Matti
[J]. ACTA MATERIALIA, 2019, 168 : 210 - 221

← 1 2 3 4 →