A Wide-Band CMOS to Waveguide Transition at mm-Wave Frequencies With Wire-Bonds

被引:41
作者
Jameson, Samuel [1 ]
Socher, Eran [1 ]
机构
[1] Tel Aviv Univ, Sch Elect Engn, IL-69978 Tel Aviv, Israel
关键词
CMOS; coplanar waveguide (CPW); millimeter-wave (mm-wave); package; printed circuit board (PCB); transition; W-band; waveguide; wire-bond; TO-MICROSTRIP TRANSITION;
D O I
10.1109/TMTT.2015.2461160
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper a two-step transition between a CMOS chip and a WR-10 waveguide is investigated. The transition between a coplanar waveguide (CPW) on Duroid to W-band aluminum waveguide is studied and measured results show a bandwidth of 49% (67-110 GHz), an average insertion loss of 0.35 dB, and return loss below 10 dB throughout the entire band. Wire-bonding is then investigated as a connection between on-chip CMOS ground-signal-ground (GSG) pads to the Duroid CPW where the CMOS to printed circuit board transition measured results show an average 1-dB loss (including the CMOS GSG launcher) in the W-band. The full transition is also used to demonstrate packaging of a 100-GHz voltage-controlled oscillator in 90-nm CMOS where the RF signal was transmitted successfully with an average 2.5-dB loss (which includes a 2-cm Duroid CPW line) compared to on-chip probing measurement results.
引用
收藏
页码:2741 / 2750
页数:10
相关论文
共 22 条
[1]   Fully micromachined W-band rectangular waveguide to grounded coplanar waveguide transition [J].
Aliakbarian, H. ;
Radiom, S. ;
Tavakol, V. ;
Reynaert, P. ;
Nauwelaers, B. ;
Vandenbosch, G. A. E. ;
Gielen, G. .
IET MICROWAVES ANTENNAS & PROPAGATION, 2012, 6 (05) :533-540
[2]   A W-Band Low-Loss and Wideband LTCC Transition From Waveguide to Microstrip [J].
Cao, Baolin ;
Wang, Hao ;
Huang, Yong ;
Wang, Jie ;
Sheng, Weixing .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2013, 23 (11) :572-574
[3]   On the use of vias in conductor-backed coplanar circuits [J].
Haydl, WH .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002, 50 (06) :1571-1577
[4]  
Jahn D, 2006, COMP SEMICOND INTEGR, P111
[5]  
Jameson S., 2014, IEEE MTT S INT MICR, P1
[6]   High Efficiency 293 GHz Radiating Source in 65 nm CMOS [J].
Jameson, Samuel ;
Socher, Eran .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2014, 24 (07) :463-465
[7]   A 210-227 GHz Transmitter With Integrated On-Chip Antenna in 90 nm CMOS Technology [J].
Khamaisi, Bassam ;
Jameson, Samuel ;
Socher, Eran .
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2013, 3 (02) :141-150
[8]  
Lee MK, 2006, 2006 FIRST INTERNATIONAL CONFERENCE ON COMMUNICATIONS AND ELECTRONICS, P505
[9]   Fully micromachined finite-ground coplanar line-to-waveguide transitions for W-band applications [J].
Lee, Y ;
Becker, JP ;
East, JR ;
Katehi, LPB .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2004, 52 (03) :1001-1007
[10]   Full W-Band Waveguide-to-Microstrip Transition With New E-Plane Probe [J].
Li, Eric S. ;
Tong, Gui-Xiang ;
Niu, Dow Chih .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2013, 23 (01) :4-6