Preparation and Performance Research on the Si3N4@SiO2/PI Nanocomposite

被引：0

作者：

Qin, Jing ^{[1
]}

Zhang, Guoping ^{[1
]}

Sun, Rong ^{[1
]}

Wong, Chingping ^{[1
]}

机构：

[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen, Peoples R China

来源：

14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) | 2012年

关键词：

SILICON-NITRIDE; POLYIMIDE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The novel core (Si3N4)-shell (SiO2) (Si3N4@SiO2) nanoparticles were successfully prepared via the Stober process, using the Si3N4 nanoparticles as the seeds. The silica coated Si3N4 composite particles were prepared by hydrolysis-condensation polymerization of tetraethylorthosilicate (TEOS) on the surface of Si3N4 particles. Then, Si3N4@SiO2 nanoparticles were introduced into the polyimide (PI) matrix to prepare the organic-inorganic hybrid nanocomposite film, and the dielectric behavior and heat-conducting property of the composite were investigated. The results showed that the thermal conductivity has been rasied by 100% from 0.203 W/m.K. to 0.441 W/m.K. and Si3N4@SiO2/PI composites possess lower dielectric constant compared to the Si3N4/PI composites, which is benefit for use of inter-level dielectric.

引用

页数：4

共 13 条

[1] Core/Shell Nanoparticles: Classes, Properties, Synthesis Mechanisms, Characterization, and Applications [J].

Chaudhuri, Rajib Ghosh ;

Paria, Santanu .

CHEMICAL REVIEWS, 2012, 112 (04) :2373-2433

[2] Effect of temperature on dielectric properties of Si3N4/SiO2 composite and silica ceramic [J].

Du, Hongli ;

Li, Yan ;

Cao, Chuanbao .

JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 503 (01) :L9-L13

[3] Bulk and surface properties of layered silicates/fluorinated polyimide nanocomposites [J].

Jiang, LY ;

Wei, KH .

JOURNAL OF APPLIED PHYSICS, 2002, 92 (10) :6219-6223

[4] Low-dielectric, nanoporous polyimide films prepared from PEO-POSS nanoparticles [J].

Lee, YJ ;

Huang, JM ;

Kuo, SW ;

Chang, FC .

POLYMER, 2005, 46 (23) :10056-10065

[5] Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric film applications [J].

Leu, CM ;

Chang, YT ;

Wei, KH .

CHEMISTRY OF MATERIALS, 2003, 15 (19) :3721-3727

[6] Silicon nitride and polyimide capping layers on InGaAs/InP PIN photodetector after sulfur treatment [J].

Ravi, MR ;

DasGupta, A ;

DasGupta, N .

JOURNAL OF CRYSTAL GROWTH, 2004, 268 (3-4) :359-363

[7] Zirconium tungstate (ZrW2O8)/polyimide nanocomposites exhibiting reduced coefficient of thermal expansion [J].

Sullivan, LM ;

Lukehart, CM .

CHEMISTRY OF MATERIALS, 2005, 17 (08) :2136-2141

[8] Properties of polyimide/Al2O3 and Si3N4 deposited thin films [J].

Tsai, Mei-Hui ;

Wang, Hong-Yi ;

Lu, Hsu-Tung ;

Tseng, I-Hsiang ;

Lu, Hung-Hua ;

Huang, Shih-Liang ;

Yeh, Jui-Ming .

THIN SOLID FILMS, 2011, 519 (15) :4969-4973

[9] Versatile ultrathin nanoporous silicon nitride membranes [J].

Vlassiouk, Ivan ;

Apel, Pavel Y. ;

Dmitriev, Sergey N. ;

Healy, Ken ;

Siwy, Zuzanna S. .

PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2009, 106 (50) :21039-21044

[10] Preparation and the properties of PMR-type polyimide composites with aluminum nitride [J].

Wang, JJ ;

Yi, XS .

JOURNAL OF APPLIED POLYMER SCIENCE, 2003, 89 (14) :3913-3917

← 1 2 →