WOOD-ADHESIVE INTERFACE CHARACTERIZATION AND MODELING IN ENGINEERED WOOD FLOORING

被引：0
|
作者：
Belleville, Benoit [1 ]
Blanchet, Plerre [1 ,2 ]
Cloutier, Alain [1 ]
Deteix, Jean [3 ]
机构：
[1] Univ Laval, Dept Sci Bois & Foret, CRB, Quebec City, PQ G1V 0A6, Canada
[2] Forintek Div, FPInnovat, Quebec City, PQ G1P 4R4, Canada
[3] Univ Laval, Dept Math & Stat, GIREF, Quebec City, PQ G1V 0A6, Canada
来源：
WOOD AND FIBER SCIENCE | 2008年 / 40卷 / 04期
基金：
加拿大自然科学与工程研究理事会;
关键词：
Diffusion coefficient; expansion coefficient; hygromechanical deformation; sugar maple; crosslinked polyvinyl acetate;
D O I：
暂无
中图分类号：
S7 [林业];
学科分类号：
0829 ; 0907 ;
摘要：
Adhesive films used in layered wood-based composites have a significant impact on moisture movement and must be considered in models of such products. The objective of this study was to characterize the wood-adhesive interface and determine its impact on the hygromechanical behavior of engineered wood flooring (EWF). The radial water vapor diffusion coefficient and the coefficients of moisture expansion were determined for sugar maple wood, crosslinked polyvinyl acetate adhesive film (XPVAc), and the wood-adhesive interface. Sugar maple wood had the highest diffusion coefficient at
引用
收藏
页码：484 / 494
页数：11
相关论文
共 50 条
  • [1] Fracture of discontinuous wood-adhesive bonds
    Conrad, MPC
    Smith, GD
    Fernlund, G
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2003, 23 (01) : 39 - 47
  • [2] Fracture of discontinuous wood-adhesive bonds
    Fernlund, G. (goran.fernlund@ubc.ca), 1600, Elsevier Ltd (23):
  • [3] Fracture of wood composites and wood-adhesive joints: A comparative review
    Conrad, MPC
    Smith, GD
    Fernlund, G
    WOOD AND FIBER SCIENCE, 2004, 36 (01): : 26 - 39
  • [4] Wood-adhesive interactions in a PVAc latex
    Lopez-Suevos, Francisco
    Frazier, Charles E.
    HOLZFORSCHUNG, 2008, 62 (04) : 468 - 471
  • [5] Nanoindentation mapping of a wood-adhesive bond
    J. Konnerth
    A. Valla
    W. Gindl
    Applied Physics A, 2007, 88 : 371 - 375
  • [6] Nanoindentation mapping of a wood-adhesive bond
    Konnerth, J.
    Valla, A.
    Gindl, W.
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2007, 88 (02): : 371 - 375
  • [7] OSB as substrate for engineered wood flooring
    Barbuta, Costel
    Blanchet, Pierre
    Cloutier, Alain
    Yadama, Vikram
    Lowell, Eini
    EUROPEAN JOURNAL OF WOOD AND WOOD PRODUCTS, 2012, 70 (1-3) : 37 - 43
  • [8] Erratum to: Comparative analysis of a wood-adhesive bondline
    G. Modzel
    F. A. Kamke
    F. De Carlo
    Wood Science and Technology, 2011, 45 (1) : 159 - 159
  • [9] RHEOLOGY OF WOOD-ADHESIVE CURE BY TORSIONAL BRAID ANALYSIS
    STEINER, PR
    WARREN, SR
    HOLZFORSCHUNG, 1981, 35 (06) : 273 - 278
  • [10] STUDY ON CONTINUOUS COLD-PRESSING TECHNOLOGY OF ENGINEERED WOOD FLOORING WITH EPI ADHESIVE
    Huang, Lingling
    Wang, Huiyun
    Guo, Xiaolei
    Jiang, Zhihua
    Xing, Feng
    Huang, Lingling
    Ekevad, Mats
    WOOD RESEARCH, 2018, 63 (02) : 335 - 342
12345