Migration issues in sintered-silver die attaches operating at high temperature

被引：48

作者：

Riva, R. ^{[1
]}

Buttay, C. ^{[1
]}

Allard, B. ^{[1
]}

Bevilacqua, P. ^{[1
]}

机构：

[1] Univ Lyon, CNRS, INSA Lyon, Lab Ampere,UMR 5005, F-69621 Villeurbanne, France

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2013.07.103

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties and can operate at higher temperature. However, silver tends to migrate in presence of electric field, oxygen (or moisture) and high temperature, causing short circuits. In this paper, we assess the extent of this issue, and we evaluate the protective effect of a thin layer of parylene. It is shown that silver migration occurs rapidly (tens to hundreds of hours at 300 degrees C), but that parylene offers a good mitigation of this issue. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：1592 / 1596

页数：5

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