Inkjet-Printed Substrate Integrated Waveguides (SIW) with "Drill-less" Vias on Paper Substrates

被引：0
|
作者：
Nauroze, Syed Abdullah [1 ]
Hester, Jimmy [1 ]
Su, Wenjing [1 ]
Tentzeris, Manos M. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2016年
关键词：
Substrate integrated waveguide; inkjet-printing on paper; Internet of things; multi-layer structures; additive manufacturing; viaholes; ELECTRONICS; ANTENNAS; CIRCUITS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, an inkjet-printed substrate integrated waveguide (SIW) on commercially available cellulose paper is implemented for the first time. Unlike traditional inkjet-printed SIW's, it does not require any etching process to form the conductive side walls and utilizes the porosity of the paper to get through-substrate conduction. The frequency response of the waveguide along with its performance under bending is discussed in this paper, verifying that such a structure would be particularly suitable for Quality of Life and Internet of Things applications
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页数：4
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