Forming solder joints by sintering eutectic tin-lead solder paste

被引：6

作者：

Palmer, MA

Alexander, CN

Nguyen, B

机构：

[1] Rensselaer Polytech Inst, Ctr Integrated Elect Elect Mfg & Elect Media, Troy, NY 12180 USA

[2] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1999年 / 28卷 / 07期

关键词：

Sn-Pb paste; sintering; solder joints;

D O I：

10.1007/s11664-999-0219-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

It is possible to form solder joints with mechanical integrity, but not mechanical strength comp arable to that achieved by melting the solder, by sintering eutectic tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to the paste. This increases the rate of sintering through liquid-phase sintering.

引用

页码：912 / 915

页数：4