Influence of silver nanopowders addition to the SAC solder paste on thermal and mechanical fatigue properties of solder joints

被引：0
作者：
Sitek, Janusz [1 ]
Koscielski, Marek [1 ]
Bukat, Krystyna [1 ]
Jakubowska, Malgorzata [2 ]
Niedzwiedz, Wojciech [3 ]
Mlozniak, Anna [4 ]
机构：
[1] Inst Tele & Radiotechniczny, PL-450 Warsaw, Poland
[2] Politechnika Warszawska, PL-02525 Warsaw, Poland
[3] Politechnika Warszawska, Wydzial Mechatroniki, PL-02525 Warsaw, Poland
[4] Inst Technol Mat Elektronicznych, PL-01919 Warsaw, Poland
来源：
PRZEGLAD ELEKTROTECHNICZNY | 2012年 / 88卷 / 11B期
关键词：
solder joints; lead-free solder pastes; nanomaterials; nanopowders; ZN-BI SOLDERS; SN-ZN; DENSITY-MEASUREMENTS; SURFACE-TENSION; PART I; WETTABILITY; COPPER; MICROSTRUCTURE; FINISHES; PCBS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The work contains the results of investigations of silver nanopowders addition to the SAC solder paste on thermal and mechanical fatigue properties of solder joints. The four solder pastes were used in investigations. They had different sizes of silver nanopowders grains and different proportional content of nanopowder in pastes. The fatigue properties of solder joints were investigated using two methods: thermal shock cycles as well as the method of mechanical cycles on a special mechanical fatigue test stand. (Influence of silver nanopowders addition to the SAC solder paste on thermal and mechanical fatigue properties of solder joints).
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页码：79 / 82
页数：4
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