Microstructuring of SU-8 photoresist by UV-assisted thermal imprinting with non-transparent mold

被引:17
|
作者
Youn, Sung-Won [1 ]
Ueno, Akihisa [1 ]
Takahashi, Masaharu [1 ]
Maeda, Ryutaro [1 ]
机构
[1] Natl Inst Adv Ind Sci & Technol, AMRI, Tsukuba, Ibaraki 3058564, Japan
关键词
UV-assisted thermal imprint; SU-8; surface pre-treatment; Ni mold; micro pattern;
D O I
10.1016/j.mee.2008.06.016
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, we explored a rapid and low-cost process for patterning in a. SU-8 photoresist by thermal imprinting with a non-transparent mold such as Ni mold. One of major obstacles in the process is that the extremely good formability of uncured SU-8 even near room temperature causes the collapse of imprinted patterns during and after de-molding because a sample cannot be exposed to UV light during imprinting owing to the non-transparency of a mold. To overcome this problem, un-cured SU-8 resists were pre-treated with UV light, heat, and 02 plasma for controlling their formability, and applied to thermal imprint tests to be compared each other in terms of the replication fidelity. As a result, a SU-8 sample re-treated with UV light for 8 s resulted in the best replication quality for given imprint conditions and p mold dimensions, and we could successfully replicate micro patterns in SU-8 resist without a quartz mold. As compared with conventional UV-imprint processes, this process has potential merits such as a lower mold cost, an easier mold release and a less air-entrapment. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:1924 / 1931
页数:8
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