The mechanics of the solder ball shear test and the effect of shear rate

被引：84

作者：

Chia, JYH

Cotterell, B

Chai, TC

机构：

[1] ASTAR, Inst Mat Res & Engn, Singapore 117602, Singapore

[2] Univ Sydney, Dept Aerosp Mech & Mechatron Engn, Sydney, NSW 2006, Australia

[3] ASTAR, Inst Microelect, Singapore 117683, Singapore

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 417卷 / 1-2期

关键词：

interfacial failure; Pb-free solder; SnPb solder; fracture toughness;

D O I：

10.1016/j.msea.2005.10.064

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A test rig was developed to do high speed solder ball shear tests on a servohydraulic testing machine. Shear tests were conducted over a range of shear rates on eutectic tin-lead and lead-free solder balls that were mounted on a chip scale package (CSP) with a solder mask defined (SMD) ball grid array (BGA) configuration and on the Cu pads in a maskless printed wire board (PWB). The high speed ball shear test was found to induce a brittle solder/pad interface fracture that resembles the fracture in lead-free interconnects of board mounted microelectronic devices that have been subjected to mechanical shock. An approximate static analysis of the solder ball shear test has been developed that enables the plastic, fracture, and friction work to be separated. This analysis suggests that the specific work after maximum load obtained for low shear rate is closely related to the toughness of the solder. Provided the fracture was stable, the specific work after maximum load was relatively insensitive to shear rate suggesting that the solder toughness is also rate insensitive. The shear strength and total specific shear work all increase with shear rate. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：259 / 274

页数：16

共 18 条

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