The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes

被引：1
|
作者：
Shih, Cheng-Hung [1 ]
Shiue, Guang-Hwa [2 ]
Wu, Tzong-Lin [1 ]
Wu, Ruey-Beei [1 ]
机构：
[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 10764, Taiwan
[2] Chung Yuan Christian Univ, Dept Elect Engn, Taipei, Taiwan
来源：
2008 ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 19TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2 | 2008年
关键词：
(i)Gsimultaneous switching noise (SSN); signal integrity (SI); electromagnetic interference (EMI); electromagnetic bandgap (EBG); slot; ground bounce noise(GBN);
D O I：
10.1109/APEMC.2008.4559837
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic band-gap (LPC-EBG) structure. However, it is unavoidable the signals will cross the LPC-EBG power plane. In this paper, the effects of signal integrity (SI) and electromagnetic interference (EMI) for differential coupled microstrip lines over the LPC-EBG power/ground planes will be investigated. The resonant frequency of LPC-EBG power plane will be picked up and appear in the radiation. The bandgap frequencies of LPC-EBG power plane will loss in weakly coupling case of differential lines at the received end. Further, the more coupling factor of differential lines is the less noise of SI and EMI is. The simulated results based on full-wave simulator will provide a good reference for the design of differential coupled microstrip lines over LPC-EBG power/ground planes.
引用
收藏
页码：164 / +
页数：2
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