A survey of computational approaches to three-dimensional layout problems

被引：150
作者：
Cagan, J [1 ]
Shimada, K [1 ]
Yin, S [1 ]
机构：
[1] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
来源：
COMPUTER-AIDED DESIGN | 2002年 / 34卷 / 08期
关键词：
intelligent packaging; product layout; optimization; stochastic optimization;
D O I：
10.1016/S0010-4485(01)00109-9
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
The component layout or packaging problem requires efficient search of large, discontinuous spaces. This survey paper reviews the state-of-the-art in product layout algorithms, The focus on optimization and geometric interference calculation strategies addresses the common aspects of the layout problem for all applications. (C) 2002 Elsevier Science Ltd. All rights reserved.
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页码：597 / 611
页数：15
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