Inverse Analysis of Solder Joint Creep Properties

被引：0

作者：

Kamara, E. ^{[1
]}

Lu, H. ^{[1
]}

Bailey, C. ^{[1
]}

Thomas, O. ^{[2
]}

Di Maio, D. ^{[2
]}

Hunt, C. ^{[2
]}

Fulton, I. ^{[2
]}

机构：

[1] Univ Greenwich, 30 Pk Row, London SE10 9LS, England

[2] Natl Phys Lab, Teddington, Middx, England

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

基金：

英国工程与自然科学研究理事会;

关键词：

FINITE-ELEMENT; BEHAVIOR; MODEL;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Experimental results from shear test on solder joints and Finite Element analysis method have been used to improve the creep constitutive equation for lead free SnAgCu solder alloy. Parameters in Anand's viscoplastic model that are most sensitive to the solder joint's stress-strain relationship have been identified and then modified in an inverse Finite Element analysis so that the new constitutive equation can be used as input data for computer simulation that predict behaviour and reliability of solder joints.

引用

页码：274 / 278

页数：5

共 20 条

[1] CONSTITUTIVE-EQUATIONS FOR THE RATE-DEPENDENT DEFORMATION OF METALS AT ELEVATED-TEMPERATURES
ANAND, L
[J]. JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 1982, 104 (01): : 12 - 17
[2] Simulation of uniaxial tensile properties for lead-free solders with modified Anand model
Bai, Ning
Chen, Xu
Gao, Hong
[J]. MATERIALS & DESIGN, 2009, 30 (01) : 122 - 128
[3] Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes
Bhate, Dhruv
Chan, Dennis
Subbarayan, Ganesh
Chiu, Tz Cheng
Gupta, Vikas
Edwards, Darvin R.
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (03): : 622 - 633
[4] AN INTERNAL VARIABLE CONSTITUTIVE MODEL FOR HOT-WORKING OF METALS
BROWN, SB
KIM, KH
ANAND, L
[J]. INTERNATIONAL JOURNAL OF PLASTICITY, 1989, 5 (02) : 95 - 130
[5] Chavali S, 2011, ELEC COMP C, P701, DOI 10.1109/ECTC.2011.5898589
[6] Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic loading
Chen, G
Chen, X
[J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2006, 43 (11-12) : 3596 - 3612
[7] Inverse problems in finite element simulation of metal forming processes
Chenot, JL
Massoni, E
Fourment, L
[J]. ENGINEERING COMPUTATIONS, 1996, 13 (2-4) : 190 - &
[8] Novel Testing Instrument for Lead-Free Solder Characterization
Di Maio, D.
Thomas, O.
Dusek, M.
Hunt, C.
[J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2011, 60 (10) : 3444 - 3450
[9] Di Maio D., 2010 11 INT THERM ME, P1
[10] An inverse finite element procedure for the determination of constitutive tensile behavior of materials using miniature specimen
Husain, A
Sehgal, DK
Pandey, RK
[J]. COMPUTATIONAL MATERIALS SCIENCE, 2004, 31 (1-2) : 84 - 92

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