Impact of the contact's geometry on the line resistivity of carbon nanotubes bundles for applications as horizontal interconnects

被引：14

作者：

Chiodarelli, N. ^{[1
]}

Fournier, A. ^{[1
]}

Dijon, J. ^{[1
]}

机构：

[1] CEA LITEN DTNM, F-38054 Grenoble, France

来源：

APPLIED PHYSICS LETTERS | 2013年 / 103卷 / 05期

关键词：

HIGH-DENSITY; INTEGRATION;

D O I：

10.1063/1.4817648

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

To use carbon nanotubes bundles as realistic interconnects, contacts must be devised so to electrically interface all the tubes encompassing a bundle. Here, we address this challenge by fabricating contacts at both the tip and the side of nanotubes bundles, in a so-called "All-Around" geometry. The measured resistivity outperforms that of identical bundles contacted at the tip only (End-Bonded geometry) proving more efficient current injection. The result is technologically relevant for all applications targeting the ultimate electrical performances of nanotubes bundles as demonstrates that good electron transparency of the contacts alone is not a sufficient condition for lowest line resistance. (C) 2013 AIP Publishing LLC.

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页数：4

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