Mechanics of Stretchable Electronics

被引：6
|
作者：
Zhang, Yihui [1 ,2 ]
Hwang, Keh-Chih [1 ]
Huang, Yonggang [2 ]
机构：
[1] Tsinghua Univ, Ctr Mech & Mat, Beijing 100084, Peoples R China
[2] NW Univ, Dept Civil & Environm Engn, Dept Mech Engn, Evanston, IL 60022 USA
来源：
ADVANCES IN ENGINEERING PLASTICITY XI | 2013年 / 535-536卷
关键词：
Stretchable and flexible electronics; plastic deformation; stretchability; LIGHT-EMITTING-DIODES; THIN-FILM; POSTBUCKLING ANALYSIS; COMPLIANT SUBSTRATE; SOFT LITHOGRAPHY; STAMP COLLAPSE; SILICON; ADHESION; DESIGNS; SEMITRANSPARENT;
D O I：
10.4028/www.scientific.net/KEM.535-536.25
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Recent advances in mechanics and materials provide routes to integrated circuits that offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent and deformed into arbitrary, curvilinear shapes. This paper summarizes developments in this emerging field, with descriptions of application opportunities, fundamental aspects, representative devices, and particularly the effect of plastic deformation.
引用
收藏
页码：25 / +
页数：6
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