Ultimate suppression of thermal transport in amorphous silicon nitride by phononic nanostructure

被引:18
|
作者
Tambo, Naoki [1 ]
Liao, Yuxuan [2 ]
Zhou, Chun [3 ]
Ashley, Elizabeth Michiko [3 ]
Takahashi, Kouhei [1 ]
Nealey, Paul F. [3 ,4 ]
Naito, Yasuyuki [1 ]
Shiomi, Junichiro [2 ]
机构
[1] Panasonic Corp, Technol Div, Kyoto, Japan
[2] Univ Tokyo, Dept Mech Engn, Tokyo, Japan
[3] Univ Chicago, Pritzker Sch Mol Engn, Chicago, IL 60637 USA
[4] Argonne Natl Lab, Mat Sci Div, 9700 S Cass Ave, Argonne, IL 60439 USA
关键词
CONDUCTIVITY; HEAT;
D O I
10.1126/sciadv.abc0075
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Engineering the thermal conductivity of amorphous materials is highly essential for the thermal management of future electronic devices. Here, we demonstrate the impact of ultrafine nanostructuring on the thermal conductivity reduction of amorphous silicon nitride (a-Si3N4) thin films, in which the thermal transport is inherently impeded by the atomic disorders. Ultrafine nanostructuring with feature sizes below 20 nm allows us to fully suppress contribution of the propagating vibrational modes (propagons), leaving only the diffusive vibrational modes (diffusons) to contribute to thermal transport in a-Si3N4. A combination of the phonon-gas kinetics model and the Allen-Feldmann theory reproduced the measured results without any fitting parameters. The thermal conductivity reduction was explained as extremely strong diffusive boundary scattering of both propagons and diffusons. These findings give rise to substantial tunability of thermal conductivity of amorphous materials, which enables us to provide better thermal solutions in microelectronic devices.
引用
收藏
页数:8
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