Phase identification of self-forming Cu-Mn based diffusion barriers on p-SiOC:H and SiO2 dielectrics using x-ray absorption fine structure

被引：46

作者：

Ablett, J. M. ^{[1
]}

Woicik, J. C. ^{[2
]}

Tokei, Zs. ^{[3
]}

List, S. ^{[4
]}

Dimasi, E. ^{[5
]}

机构：

[1] Synchrotron Soleil, Lorme Merisiers, F-91192 Gif Sur Yvette, France

[2] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA

[3] IMEC, B-3001 Louvain, Belgium

[4] Intel Assignee Semicond Res Org, Res Triangle Pk, NC 27709 USA

[5] Brookhaven Natl Lab, Natl Synchrotron Light Source, Upton, NY 11973 USA

来源：

APPLIED PHYSICS LETTERS | 2009年 / 94卷 / 04期

关键词：

copper alloys; diffusion barriers; manganese alloys; metallic thin films; porous materials; segregation; X-ray absorption spectra; MG ALLOY-FILMS; MASS-SPECTROMETRY; GRAIN-GROWTH; SEGREGATION; INTERCONNECTS; CONSTITUENTS;

D O I：

10.1063/1.3068500

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

X-ray absorption fine structure spectroscopy has been used to study the chemical and structural properties of self-forming diffusion barrier layers from Cu-8 at. % Mn alloy films on porous low-k and thermally grown SiO2 dielectrics. For the porous low-k/Cu(Mn) system, we provide evidence that the interface is composed of MnSiO3 and MnO with near complete Mn segregation from the alloy film; however, we find that the self-forming process does not go to full completion on thermally grown SiO2 substrates.

引用

页数：3

共 26 条

[11]

IIJIMA J, 2008, S P MAT RES SOC, V1079

[12] EVIDENCE FOR SOLUTE SEGREGATION ON CU-MN ALLOY SURFACES STUDIED BY LOW-ENERGY ION-SCATTERING [J].

KATAYAMA, I ;

OURA, K ;

SHOJI, F ;

HANAWA, T .

PHYSICAL REVIEW B, 1988, 38 (03) :2188-2191

[13] OXYGEN-ENHANCED SURFACE SEGREGATION OF MN IN CU-MN AND AG-MN ALLOY-FILMS STUDIED BY ISS AES [J].

KATAYAMA, I ;

OURA, K ;

SHOJI, F ;

HANAWA, T .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1988, 27 (10) :L1822-L1824

[14] Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn/SiO2 interface [J].

Koike, J. ;

Haneda, M. ;

Iijima, J. ;

Otsuka, Y. ;

Sako, H. ;

Neishi, K. .

JOURNAL OF APPLIED PHYSICS, 2007, 102 (04)

[15] Self-forming diffusion barrier layer in Cu-Mn alloy metallization [J].

Koike, J ;

Wada, M .

APPLIED PHYSICS LETTERS, 2005, 87 (04)

[16]

KOIKE J, 2006, AIP C P, V817, P43, DOI DOI 10.1063/1.2173530

[17]

LEWIN K, 1993, SCAND J METALL, V22, P310

[18]

Massalski T.B., 1996, Binary Alloy Phase Diagrams, V2nd

[19]

NEISHI K, 2008, S P MAT RES SOC, V1079

[20] Activity measurement of the constituents in liquid Cu-Al alloy with mass-spectrometry [J].

Oyamada, H ;

Nagasaka, T ;

Hino, M .

MATERIALS TRANSACTIONS JIM, 1998, 39 (12) :1225-1229

← 1 2 3 →