Influence of stacking fault energy on microstructural development in equal-channel angular pressing

被引:166
作者
Komura, S [1 ]
Horita, Z
Nemoto, M
Langdon, TG
机构
[1] Kyushu Univ, Fac Engn, Dept Mat Sci & Engn, Fukuoka 8128581, Japan
[2] Univ So Calif, Dept Mat Sci & Mech Engn, Los Angeles, CA 90089 USA
基金
美国国家科学基金会; 日本学术振兴会;
关键词
D O I
10.1557/JMR.1999.0546
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Equal-channel angular (ECA) pressing is a procedure having the capability of introducing an ultrafine grain size into a material. Experiments were conducted to examine the effect of the low stacking fault energy in pure Cu on microstructural development during ECA pressing at room temperature. The results show that the low stacking fault energy and the consequent low rate of recovery lead to a very slow evolution of the microstructure during pressing. Ultimately, a stable grain size of -0.27 mu m was established in pure Cu but the microstructure was not fully homogeneous even after pressing to a total strain of similar to 10. It is shown by static annealing that the as-pressed grains are stable up to similar to 400 K, but at higher temperatures there is grain growth. These results lead to the conclusion that a low stacking fault energy is especially favorable for the introduction of an exceptionally small grain size using the ECA pressing procedure.
引用
收藏
页码:4044 / 4050
页数:7
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