Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies

被引：8

作者：

Li, JF ^{[1
]}

Mannan, SH ^{[1
]}

Clode, MP ^{[1
]}

机构：

[1] Kings Coll London, Dept Mech Engn, London WC2R 2LS, England

来源：

SCRIPTA MATERIALIA | 2006年 / 54卷 / 10期

基金：

英国工程与自然科学研究理事会;

关键词：

interface dynamics; intermetallic compounds; kinetics; liquid; modelling;

D O I：

10.1016/j.scriptamat.2006.01.037

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The rates of barrier layer thickness losses for Ni, Cu, Pt, Ti, V, Nb. Ta and W metallizations in contact with the molten 52In-48Sn solder at 200 degrees C have been studied. Despite the expected complexity of the kinetics of dissolution and intermetallic compound growth, we demonstrate simple empirical relationships between the lifetimes of 1 mu m thick barrier layers and thermodynamic properties such as their melting point, specific heat and latent heat of fusion. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1773 / 1778

页数：6

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