Triple-sided charged plasma symmetric lateral bipolar transistor on SiGe-OI

被引:7
作者
Devi, L. Beloni [1 ]
Singh, Kundan [1 ,2 ]
Kumar, Jitendra [1 ]
Srivastava, A. [1 ]
机构
[1] Jawaharlal Nehru Univ, Sch Comp & Syst Sci, New Delhi 110067, India
[2] Inter Univ Accelerator Ctr, Aruna Asaf Ali Marg, New Delhi 110067, India
关键词
charged plasma; triple sided charge plasma; symmetric lateral bipolar transistor (SLBT); uniform 0.3Ge content; linearly graded SiGe; GE ION-IMPLANTATION; SOI;
D O I
10.1088/1361-6641/ab10f2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel triple sided charged plasma (3SCP) device structure of a symmetric lateral bipolar transistor (SLBT) on silicon-germanium on insulator (SiGe-OI) is proposed. Charged plasma lateral bipolar transistor on SOI have many advantages especially in overcoming the thermal budget in addition to high gain and high speed for analog signal applications. In this paper we have carried out a systematic study of this novel 3SCP SLBT with uniform 0.3 Ge content in silicon and with linearly graded SiGe as the active device layer. With 3SCP SLBT having linearly graded SiGe as active device layer we were able to achieve a current gain > 10(4), f(T) > 200 GHz and f(max) > 1130 GHz. We were able to demonstrate improvement in terms of current gain, f(T) and f(max) by around 4.52, 2.55 and 2.07 times respectively with our novel design as compared to the conventional charged plasma symmetric lateral bipolar transistor (CP SLBT) having uniform 0.3Ge content in Silicon as active device layer. A complementary 3SCP symmetric lateral bipolar inverter with linearly graded SiGe as active device layer is also discussed for digital applications. The inverter shows switching voltage (V-M) = 0.4616 V, low noise margin (N-ML) = 0.4302 V and high noise margin (NMH) = 0.4725 V when operated at 1.0 V.
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页数:10
相关论文
共 19 条
[1]  
[Anonymous], 2014, DEVICE USER GUIDE VE
[2]  
Cai J., 2011, P IEEE INT EL DEV M, P386, DOI DOI 10.1109/IEDM.2011.6131565
[3]   GRADED-BANDGAP SIGE BIPOLAR-TRANSISTOR FABRICATED WITH GERMANIUM ION-IMPLANTATION [J].
FUKAMI, A ;
SHOJI, K ;
NAGANO, T ;
TOKUYAMA, T ;
YANG, CY .
MICROELECTRONIC ENGINEERING, 1991, 15 (1-4) :15-18
[4]  
Hu C, 2010, MODERN SEMICONDUCTOR
[5]   The Charge Plasma P-N Diode [J].
Hueting, Raymond J. E. ;
Rajasekharan, Bijoy ;
Salm, Cora ;
Schmitz, Jurriaan .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (12) :1367-1369
[6]   HETEROSTRUCTURE BIPOLAR-TRANSISTORS AND INTEGRATED-CIRCUITS [J].
KROEMER, H .
PROCEEDINGS OF THE IEEE, 1982, 70 (01) :13-25
[7]   Bipolar Charge-Plasma Transistor: A Novel Three Terminal Device [J].
Kumar, M. Jagadesh ;
Nadda, Kanika .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (04) :962-967
[8]   Ge ion implantation in Si for the fabrication of Si/GexSi1-x heterojunction transistors [J].
Lombardo, S ;
Raineri, V ;
LaVia, F ;
Iacona, F ;
Campisano, SU ;
Pinto, A ;
Ward, P .
MATERIALS CHEMISTRY AND PHYSICS, 1996, 46 (2-3) :156-160
[9]   Si/GexSi1-x heterojunction bipolar transistors formed by Ge ion implantation in Si.: Narrowing of band gap and base width [J].
Lombardo, S ;
Spinella, C ;
Campisano, SU ;
Pinto, A ;
Ward, P .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1999, 147 (1-4) :56-61
[10]   A Perspective on SOI Symmetric Lateral Bipolar Transistors for Ultra-Low-Power Systems [J].
Ning, Tak H. .
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2016, 4 (05) :227-235