Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures

被引:33
作者
Chai, Wenwen [1 ]
Jiao, Dan [1 ]
机构
[1] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
基金
美国国家科学基金会;
关键词
Direct solvers; electromagnetic analysis; fast integral equation (IE) solvers; impedance extraction; interconnects; HIERARCHICAL ALGORITHM; CAPACITANCE EXTRACTION; EFFICIENT TECHNIQUE; SOLVER; APPROXIMATION; ACCURACY;
D O I
10.1109/JPROC.2012.2190577
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We develop a linear-complexity direct matrix solution for the surface integral equation (IE)-based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a dielectric material. A direct inverse of a highly irregular system matrix composed of both dense and sparse matrix blocks is obtained in O(N) complexity with N being the matrix size. It outperforms state-of-the-art impedance solvers, be they direct solvers or iterative solvers, with fast central processing unit (CPU) time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns. The inverse of a 2.68-million-unknown matrix arising from the extraction of a large-scale 3-D interconnect having 128 buses, which is a matrix solution for 2.68 million right-hand sides, was obtained in less than 1.5 GB memory and 1.3 h on a single CPU running at 3 GHz.
引用
收藏
页码:372 / 388
页数:17
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