In situ study the dependence of electrochemical migration of tin on chloride

被引：58

作者：

Zhong, Xiankang ^{[1
]}

Zhang, Guoan ^{[1
]}

Qiu, Yubin ^{[1
]}

Chen, Zhenyu ^{[1
]}

Zou, Wenxin ^{[1
]}

Guo, Xingpeng ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Chem & Chem Engn, Hubei Key Lab Mat Chem & Serv Failure, Wuhan 430074, Peoples R China

来源：

ELECTROCHEMISTRY COMMUNICATIONS | 2013年 / 27卷

基金：

中国国家自然科学基金;

关键词：

Electrochemical migration; Dendrite growth; Tin; Chloride; Thin electrolyte layer; SOLDER;

D O I：

10.1016/j.elecom.2012.11.010

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The dependence of electrochemical migration (ECM) of tin on chloride was investigated using in situ electrochemical and optical techniques. An interesting phenomenon is first found that tin dendrite grows not only in the electrolyte layer with low chloride concentration but also in the electrolyte layer with high chloride concentration, although it is generally suggested that the growth of tin dendrite through ECM is not available in solution with high chloride concentration. Mechanisms have been proposed to explain the ECM of tin in the electrolyte layer with various chloride concentrations. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：63 / 68

页数：6

共 11 条

[1] Irregular effect of chloride impurities on migration failure reliability:: contradictions or understandable? [J].

Harsányi, G .

MICROELECTRONICS RELIABILITY, 1999, 39 (09) :1407-1411

[2] Effect of ionization characteristics on electrochemical migration lifetimes of Sn-3.0Ag-0.5Cu solder in NaCl and Na2SO4 solutions [J].

Jung, Ja-Young ;

Lee, Shin-Bok ;

Lee, Ho-Young ;

Joo, Young-Chang ;

Park, Young-Bae .

JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (08) :1111-1118

[3] In situ optical inspection of electrochemical migration during THB tests [J].

Medgyes, Balint ;

Illes, Balazs ;

Berenyi, Richard ;

Harsanyi, Gabor .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (06) :694-700

[4] On the electrochemical migration mechanism of tin in electronics [J].

Minzari, Daniel ;

Jellesen, Morten S. ;

Moller, Per ;

Ambat, Rajan .

CORROSION SCIENCE, 2011, 53 (10) :3366-3379

[5] Electrochemical migration of tin in electronics and microstructure of the dendrites [J].

Minzari, Daniel ;

Grumsen, Flemming Bjerg ;

Jellesen, Morten S. ;

Moller, Per ;

Ambat, Rajan .

CORROSION SCIENCE, 2011, 53 (05) :1659-1669

[6] Characteristics of environmental factor for electrochemical migration on printed circuit board [J].

Noh, Bo-In ;

Jung, Seung-Boo .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2008, 19 (10) :952-956

[7]

Pourbaix M., 1974, Atlas of Electrochemical Equilibria in Aqueous Solutions, V2nd

[8]

Schlesinger M., 2000, Modern electroplating

[9] Initial stage of pitting corrosion of type 304 stainless steel under thin electrolyte layers containing chloride ions [J].

Tsutsumi, Y ;

Nishikata, A ;

Tsuru, T .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (09) :B358-B363

[10] Influence of Electrochemical Properties on Electrochemical Migration of SnPb and SnBi Solders [J].

Yoo, Y. R. ;

Kim, Y. S. .

METALS AND MATERIALS INTERNATIONAL, 2010, 16 (05) :739-745

← 1 2 →