Shape Deformation in Two-Dimensional Electrical Impedance Tomography

被引:31
作者
Boyle, Alistair [1 ]
Adler, Andy [1 ]
Lionheart, William R. B. [2 ]
机构
[1] Carleton Univ, Dept Syst & Comp Engn, Ottawa, ON K1S 5B6, Canada
[2] Univ Manchester, Sch Math, Manchester M60 1QD, Lancs, England
基金
英国工程与自然科学研究理事会; 加拿大自然科学与工程研究理事会;
关键词
Biomedical imaging; conformal mapping; finite element methods; impedance measurement; reconstruction algorithms; shape measurement; tomography; INVERSE CONDUCTIVITY PROBLEM; IMPERFECTLY KNOWN BOUNDARY; EIT;
D O I
10.1109/TMI.2012.2204438
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
Electrical impedance tomography (EIT) uses measurements from surface electrodes to reconstruct an image of the conductivity of the contained medium. However, changes in measurements result from both changes in internal conductivity and changes in the shape of the medium relative to the electrode positions. Failure to account for shape changes results in a conductivity image with significant artifacts. Previous work to address shape changes in EIT has shown that in some cases boundary shape and electrode location can be uniquely determined for isotropic conductivities; however, for geometrically conformal changes, this is not possible. This prior work has shown that the shape change problem can be partially addressed. In this paper, we explore the limits of compensation for boundary movement in EIT using three approaches. First, a theoretical model was developed to separate a deformation vector field into conformal and nonconformal components, from which the reconstruction limits may be determined. Next, finite element models were used to simulate EIT measurements from a domain whose boundary has been deformed. Finally, an experimental phantom was constructed from which boundary deformation measurements were acquired. Results, both in simulation and with experimental data, suggest that some electrode movement and boundary distortions can be reconstructed based on conductivity changes alone while reducing image artifacts in the process.
引用
收藏
页码:2185 / 2193
页数:9
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