A comparative study of reactive wetting of lead and lead-free solders on Cu and (Cu6Sn5/Cu3Sn)/Cu substrates

被引：28

作者：

Wang, Hongqin ^{[1
,2
,3
]}

Zhao, Hui ^{[1
]}

Sekulic, Dusan P. ^{[1
,4
]}

Qian, Yiyu ^{[2
]}

机构：

[1] Univ Kentucky, Ctr Mfg, Lexington, KY 40506 USA

[2] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China

[3] S China Univ Technol, Sch Mech Engn, Guangzhou 510640, Guangdong, Peoples R China

[4] Univ Kentucky, Dept Mech Engn, Lexington, KY 40506 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 10期

关键词：

wetting; bonding; intermetallics; lead-free solders;

D O I：

10.1007/s11664-008-0502-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Reactive wetting of solders on Cu and Cu(6)Sn(5)/Cu(3)Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu(6)Sn(5)/Cu(3)Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu(6)Sn(5)/Cu(3)Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu(6)Sn(5)/Cu(3)Sn/Cu substrates.

引用

页码：1640 / 1647

页数：8

共 21 条

[1] Lead-free solders in microelectronics [J].