Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

被引：17
作者：
Hoelck, O. [1 ,2 ]
Bauer, J. [1 ]
Wittler, O. [1 ]
Michel, B.
Wunderle, B. [1 ,2 ]
机构：
[1] Fraunhofer Inst Reliabil & Microintegrat IZM, D-13355 Berlin, Germany
[2] Tech Univ Chemnitz, Chemnitz, Germany
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 07期
关键词：
FORCE-FIELD; SIMULATION;
D O I：
10.1016/j.microrel.2012.03.019
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An investigation of interfacial interaction has been performed between three epoxy molding compound materials and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The epoxy materials were an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN), its filled variety EPNF (with silica particles) and a model aromatic epoxy(1) (2 1 2). All systems are described in full in [1] and [2]. The free surfaces of the solid materials were experimentally analyzed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted. (C) 2012 Elsevier Ltd. All rights reserved.
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页码：1285 / 1290
页数：6
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