Design, fabrication and characterization of an integrated micro heat pipe

被引:3
|
作者
Lee, M [1 ]
Wong, M [1 ]
Zohar, Y [1 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Mech Engn, Kowloon, Hong Kong, Peoples R China
来源
FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年
关键词
D O I
10.1109/MEMSYS.2002.984096
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The design, fabrication and characterization of an integrated microsystem consisting of micro heat pipes, a micro heater, temperature and capacitive microsensors are presented. CMOS-compatible micromachining techniques are utilized to fabricate the micro heat pipe device capped by a nitride layer, In order to allow clear visualizations of the flow patterns during operation, the process has been modified using a glass wafer to cap the heat pipes. Temperature distributions along the micro heat pipes have been measured using the microsensors located next to the heat pipes. The capacitive microsensors, have been used to measure the void-fraction, taking advantage of the large difference between the dielectric constants of the liquid and vapor phases.
引用
收藏
页码:85 / 88
页数:4
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