Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution

被引：52
作者：
Osorio, Wislei R. [1 ,2 ]
Freitas, Emmanuelle S. [2 ]
Spinelli, Jose E. [3 ]
Garcia, Amauri [2 ]
机构：
[1] Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP, Brazil
[2] Univ Estadual Campinas, UN1CAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazil
[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP, Brazil
来源：
CORROSION SCIENCE | 2014年 / 80卷
基金：
巴西圣保罗研究基金会;
关键词：
Tin; Solder; EIS; Polarization; Corrosion; Metallurgy; MECHANICAL-PROPERTIES; CORROSION BEHAVIOR; DIRECTIONAL SOLIDIFICATION; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE; PARAMETERS; ZN; AG; AG3SN; INHIBITION;
D O I：
10.1016/j.corsci.2013.11.010
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 degrees C It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (i(corr)) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on i(corr), is also discussed. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码：71 / 81
页数：11
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