Deformable printed circuit boards that enable metamorphic electronics

被引:18
作者
Biswas, Shantonu [1 ]
Schoeberl, Andreas [1 ]
Mozafari, Mahsa [1 ]
Pezoldt, Joerg [1 ]
Stauden, Thomas [1 ]
Jacobs, Heiko O. [1 ]
机构
[1] Tech Univ Ilmenau, Fachgebiet Nanotechnol, Gustav Kirchhoff Str 1, D-98693 Ilmenau, Germany
关键词
HIGH-PERFORMANCE ELECTRONICS; STRETCHABLE ELECTRONICS; EPIDERMAL ELECTRONICS; INTEGRATED-CIRCUITS; GAAS; SILICON; SKIN; INTERCONNECTS; FABRICATION; TECHNOLOGY;
D O I
10.1038/am.2016.186
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A method to produce single-layer deformable and stretchable printed circuit boards is reported and applied to enable the realization of metamorphic electronic products that can take on new three-dimensional (3D) shapes. The models contain arrays with packaged surface mount devices and bare dies that integrate light-emitting diodes (LEDs) and transistors within a rubber matrix. The test structures morph from planar to spherical to cone-like topologies. In one approach, the thickness of the stretchable printed circuit board is locally adjusted to control the morphological changes. In addition, a three-dimensionally-shaped chaperon is introduced to enable more abrupt topological changes. A comparative study of various designs of the metallization layer and stress-relieving reinforcing elements identified a highly stretchable and deformable design (up to 315% or six thousand 150% stretch and release cycles), which shields the interface between the hard and non-stretchable components from high levels of stress.
引用
收藏
页码:e336 / e336
页数:8
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