Laser ablation of sapphire with a pulsed ultra-violet laser beam

被引：0

作者：

Tamura, S ^{[1
]}

Horisawa, H ^{[1
]}

Yamaguchi, S ^{[1
]}

Yasunaga, N ^{[1
]}

机构：

[1] Tokai Univ, Sch Engn, Dept Precis Mech, Hiratsuka, Kanagawa 25912, Japan

来源：

INITIATIVES OF PRECISION ENGINEERING AT THE BEGINNING OF A MILLENNIUM | 2001年

关键词：

laser machining; Nd : YAG laser; ultra-violet laser beam; THG wave; sapphire;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A study on machining characteristics of sapphire using a short-pulse ultra-violet laser was conducted. As results, a control of the removal depth with the THG pulses was easier than those with SHG and fundamental pulses. Also, little redeposition of molten material around the craters was seen and a clean removal was found to be possible. Small pits with cracks were induced through a laser pulse irradiation at the spots of intrinsic lattice defects along the crystal orientation of the original polished-surface. The pits on the reverse side surface were also found at the points of lattice defects. Moreover, diamond-shaped pits or micro-plateaus with a flat bottom surface were formed near the beam center. Repetition of the pulse irradiation was found having similar effects to that of the chemical etching in cases of the THG pulse irradiation.

引用

页码：224 / 228

页数：5

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