Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

被引：27

作者：

Cho, SW ^{[1
]}

Han, K ^{[1
]}

Yi, YJ ^{[1
]}

Kang, SJ ^{[1
]}

Yoo, KH ^{[1
]}

Jeong, K ^{[1
]}

Whang, CN ^{[1
]}

机构：

[1] Yonsei Univ, Inst Phys & Appl Phys, Seoul 120749, South Korea

来源：

ADVANCED ENGINEERING MATERIALS | 2006年 / 8卷 / 1-2期

关键词：

D O I：

10.1002/adem.200500188

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.

引用

页码：111 / 114

页数：4

共 9 条

[1] Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates [J].

Chuang, CM ;

Shi, PC ;

Lin, KL .

PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, :360-365

[2]

COYLE RJ, 2000, EL COMP TECHN C IEEE, V50, P160

[3] Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints [J].

Kim, KS ;

Huh, SH ;

Suganuma, K .

JOURNAL OF ALLOYS AND COMPOUNDS, 2003, 352 (1-2) :226-236

[4]

SATTIRAJU SV, 2002, IEEE T ELECT PACK, V25, P1338

[5] Physics and materials challenges for lead-free solders [J].

Tu, KN ;

Gusak, AM ;

Li, M .

JOURNAL OF APPLIED PHYSICS, 2003, 93 (03) :1335-1353

[6] Characterization of surface chemical states of a thick insulator: Chemical state imaging on MgO surface [J].

Yi, YJ ;

Cho, SW ;

Noh, M ;

Whang, CN ;

Jeong, K ;

Shin, HJ .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (02) :861-864

[7] Influence of interdiffusion and surfactants on Si/SiGe heterointerfaces [J].

Zeindl, HP ;

Nilsson, S ;

Jagdhold, U ;

Klatt, J ;

Kurps, R ;

Kruger, D ;

Bugiel, E .

APPLIED SURFACE SCIENCE, 1996, 102 :107-111

[8] Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging [J].

Zhang, W ;

Liu, CZ ;

Li, DX ;

Sui, ML .

ADVANCED ENGINEERING MATERIALS, 2004, 6 (04) :232-234

[9] Solder joint reliability of plastic ball grid array packages [J].

Zhong, CH ;

Yi, S .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (01) :44-48

← 1 →