An application of Au thin-film emissivity barrier on Ni alloy

被引:52
作者
Huang, Zhibin [1 ]
Zhu, Dongmei [1 ]
Lou, Fa [1 ]
Zhou, Wancheng [1 ]
机构
[1] NW Polytech Univ, Sch Mat Sci & Engn, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
关键词
Emissivity barrier; Au film; Interdiffusion;
D O I
10.1016/j.apsusc.2008.07.185
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
1000 nm-thick Au film was sputter-deposited on two groups of nickel alloy substrates, in which one group (Group A) was oxidated at 800 degrees C for 20 h to form a oxide film before coating gold while another group (Group B) was unoxidated. The gold thin-film is applied to serve as a low emissivity coating to reflect thermal radiation. The gold-coated samples were heated in air at 600 degrees C for 150 h to explore the effect of high-temperature environment on the emissivity of coated Au film. After heat-treatment, the average thermal emissivity at the wavelength of 3-14 mu m of Group B greatly increased from 0.18 to 0.82 while that of Group A only increased a little. The diffusion between Au and other nickel alloy elements at 600 degrees C also had been discussed in this paper. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:2619 / 2622
页数:4
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