Applicability of VCCT in mode I loading of yielding adhesively bonded joints-a case study

被引:38
|
作者
Jokinen, Jarno [1 ]
Wallin, Markus [1 ]
Saarela, Olli [1 ]
机构
[1] Aalto Univ, Dept Appl Mech, Espoo, Finland
基金
芬兰科学院;
关键词
Fracture mechanics; Virtual crack closure technique; Plasticity; Double cantilever beam; Adhesive; ENERGY-RELEASE RATE; FRACTURE; CRACKS;
D O I
10.1016/j.ijadhadh.2015.07.004
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Virtual Crack Closure Technique (VCCT) is a fracture analysis method that is typically utilised when plastic dissipation does not exist. This paper studies the applicability of VCCT for crack growth analyses of an adhesively bonded joint with a ductile adhesive and self-similar crack growth. Analyses were performed for a Double Cantilever Beam (DCB) specimen with epoxy adhesive. Reference data for the analysis case existed. The precrack cycle of the DCB test was first analysed assuming linear elastic behaviour of the adhesive and by using the measured average fracture energy as a critical value. The computed force-displacement curve was noted to match well with the experimental data. In the next step, a nonlinear analysis was performed by using a linear elastic - ideally plastic material model for the adhesive and by selecting the critical energy release rate value so that the computed force-displacement curve fit the experimental and linear analysis data. The approach allowed for extracting plastic dissipation from the measured fracture energy to obtain an estimate for the critical energy release rate. The nonlinear analysis results were further studied using the Energy Derivate Technique (EDT) as a post-processing tool. The EDT analysis results confirmed that plastic dissipation remains at a constant level for the entire crack propagation phase of the precrack cycle analysis. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:85 / 91
页数:7
相关论文
共 50 条
  • [11] Effect of environmental conditioning on pure mode I fracture behaviour of adhesively bonded joints
    Abdel-Monsef, S.
    Renart, J.
    Carreras, L.
    Maimi, P.
    Turon, A.
    THEORETICAL AND APPLIED FRACTURE MECHANICS, 2020, 110
  • [12] Investigation of the mode I fracture properties of adhesively bonded joints after water ageing
    Leplat, Johnatan
    Stamoulis, Georgios
    Bidaud, Pierre
    Thevenet, David
    JOURNAL OF ADHESION, 2022, 98 (01) : 68 - 89
  • [13] Block loading fatigue of adhesively bonded pultruded GFRP joints
    Sarfaraz, Roohollah
    Vassilopoulos, Anastasios P.
    Keller, Thomas
    INTERNATIONAL JOURNAL OF FATIGUE, 2013, 49 : 40 - 49
  • [14] Mode I and II fracture behavior of adhesively-bonded pultruded composite joints
    Zhang, Ye
    Vassilopoulos, Anastasios P.
    Keller, Thomas
    ENGINEERING FRACTURE MECHANICS, 2010, 77 (01) : 128 - 143
  • [15] Distributed backface strain sensing of composite adhesively bonded joints under mode II fatigue loading
    Panerai, A.
    Oneda, B.
    Martulli, L. M.
    Bernasconi, A.
    Carboni, M.
    COMPOSITES PART B-ENGINEERING, 2025, 291
  • [16] A NUMERICAL STUDY OF ADHESIVELY BONDED LAP JOINTS
    CHIU, WK
    JONES, R
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1992, 12 (04) : 219 - 225
  • [17] Cohesive laws of composite bonded joints under mode I loading
    Dias, G. F.
    de Moura, M. F. S. F.
    Chousal, J. A. G.
    Xavier, J.
    COMPOSITE STRUCTURES, 2013, 106 : 646 - 652
  • [18] Effect of curved delamination front on mode-I fracture toughness of adhesively bonded joints
    Jiang, Zhengwen
    Wan, Shui
    Zhong, Zhipeng
    Li, Shuqin
    Shen, Kongjian
    ENGINEERING FRACTURE MECHANICS, 2015, 138 : 73 - 91
  • [19] Theoretical analysis of mode I fracture of adhesively bonded bi-material DCB joints
    Wang, Wandong
    Zhang, Shijie
    He, Rui
    Zhu, Yangxuan
    Zhao, Tian
    Yao, Xudan
    Ma, Yu'e
    ENGINEERING FRACTURE MECHANICS, 2024, 309
  • [20] A Rate-Dependent Cohesive Zone Model for Adhesively Bonded Joints Loaded in Mode I
    Marzi, S.
    Hesebeck, O.
    Brede, M.
    Kleiner, F.
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2009, 23 (06) : 881 - 898