Vibrational Coupling and Kapitza Resistance at a Solid-Liquid Interface

被引:34
作者
Ge, Song [1 ]
Chen, Min [1 ]
机构
[1] Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China
基金
中国国家自然科学基金;
关键词
Kapitza resistance; Molecular dynamics simulation; Solid/liquid interface; Vibrational coupling; MOLECULAR-DYNAMICS; THERMAL CONDUCTANCE; HEAT-FLOW; TRANSPORT;
D O I
10.1007/s10765-012-1362-2
中图分类号
O414.1 [热力学];
学科分类号
摘要
The rapid development and application of nanotechnologies have promoted an increasing interest in research on heat transfer across the solid/liquid interface. In this study, molecular dynamics simulations are carried out to elucidate the effect of vibrational coupling between the solid and the liquid phases on the Kapitza thermal resistance. This is accomplished by altering the atomic mass and interatomic interaction strength in the solid phase (thus, the vibrational properties), while keeping the solid-liquid interfacial interaction unchanged. In this way, the Kapitza resistance can be altered with a constant work of adhesion between the solid and the liquid phases. The simulation results show that the overlap degree between the vibrational density of states profiles of the interfacial liquid layer and the outermost solid layer, which measures the degree of interfacial vibrational coupling, increases with larger atomic mass and weaker inter-atomic interaction in the solid phase. An inverse relation exists between the Kapitza resistance and the overlap degree of the vibrational density of states profiles. It means that the Kapitza resistance decreases with better interfacial vibrational coupling. The simulations show that the Kapitza resistance is not only affected by the interfacial bonding strength but also the vibrational coupling between the solid and the liquid atoms. The interfaces with better thermal transport efficiency should be the ones with stronger interfacial interaction and preferable vibrational coupling between solid and liquid phases.
引用
收藏
页码:64 / 77
页数:14
相关论文
共 36 条
[21]   Thermal interactions in nanoscale fluid flow: molecular dynamics simulations with solid-liquid interfaces [J].
Kim, Bo Hung ;
Beskok, Ali ;
Cagin, Tahir .
MICROFLUIDICS AND NANOFLUIDICS, 2008, 5 (04) :551-559
[22]   Molecular dynamics simulations of thermal resistance at the liquid-solid interface [J].
Kim, Bo Hung ;
Beskok, Ali ;
Cagin, Tahir .
JOURNAL OF CHEMICAL PHYSICS, 2008, 129 (17)
[23]   Thermal boundary resistance at the graphene-oil interface [J].
Konatham, Deepthi ;
Striolo, Alberto .
APPLIED PHYSICS LETTERS, 2009, 95 (16)
[24]   Simulating Interfacial Thermal Conductance at Metal-Solvent Interfaces: The Role of Chemical Capping Agents [J].
Kuang, Shenyu ;
Gezelter, J. Daniel .
JOURNAL OF PHYSICAL CHEMISTRY C, 2011, 115 (45) :22475-22483
[25]   Solid-liquid surface free energy of Lennard-Jones liquid on smooth and rough surfaces computed by molecular dynamics using the phantom-wall method [J].
Leroy, Frederic ;
Mueller-Plathe, Florian .
JOURNAL OF CHEMICAL PHYSICS, 2010, 133 (04)
[26]   Effect of molecular film thickness on thermal conduction across solid-film interfaces [J].
Liang, Zhi ;
Tsai, Hai-Lung .
PHYSICAL REVIEW E, 2011, 83 (06)
[27]   Thermal transport across nanoscale solid-fluid interfaces [J].
Murad, Sohail ;
Puri, Ishwar K. .
APPLIED PHYSICS LETTERS, 2008, 92 (13)
[28]   FAST PARALLEL ALGORITHMS FOR SHORT-RANGE MOLECULAR-DYNAMICS [J].
PLIMPTON, S .
JOURNAL OF COMPUTATIONAL PHYSICS, 1995, 117 (01) :1-19
[29]  
Rowlinson J.S, 1982, MOL THEORY CAPILLARI
[30]   Hydrogen-bond enhanced thermal energy transport at functionalized, hydrophobic and hydrophilic silica-water interfaces [J].
Schoen, Philipp A. E. ;
Michel, Bruno ;
Curioni, Alessandro ;
Poulikakos, Dimos .
CHEMICAL PHYSICS LETTERS, 2009, 476 (4-6) :271-276