A low-power 64-84GHz frequency quadrupler based on transformer-coupled resonators for E-Band backhaul applications

被引：0

作者：

Iotti, Lorenzo ^{[1
]}

Mazzanti, Andrea ^{[1
]}

Svelto, Francesco ^{[1
]}

机构：

[1] Univ Pavia, Dept Elect Comp & Biomed Engn, I-27100 Pavia, Italy

来源：

2016 12TH CONFERENCE ON PH.D. RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME) | 2016年

关键词：

mm-Wave; E-Band; frequency quadrupler; frequency multiplier; transformer-coupled resonators; BiCMOS;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper presents a BiCMOS mm-Wave frequency quadrupler for E-band wireless backhaul applications. The circuit is intended to be a building block of a low-phase-noise E-Band frequency synthesizer. The multiplier employs transformer-coupled resonators for GBW enhancement and single-ended-to-differential conversion. The measured prototype achieves 27% fractional bandwidth around 74 GHz, with only 7mW power consumption.

引用

页数：4

共 5 条

[1] Design of low-power wideband frequency quadruplers based on transformer-coupled resonators for E-Band backhaul applications
Iotti, Lorenzo
Bassi, Matteo
Mazzanti, Andrea
Svelto, Francesco
INTEGRATION-THE VLSI JOURNAL, 2017, 58 : 413 - 420
[2] Wideband transformer-coupled E-band power amplifier in 90 nm CMOS
Gertman, Igor
Socher, Eran
INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2013, 5 (01) : 71 - 75
[3] Analysis and Design of an E-Band Transformer-Coupled Low-Noise Quadrature VCO in 28-nm CMOS
Vigilante, Marco
Reynaert, Patrick
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2016, 64 (04) : 1122 - 1132
[4] A Low-Power 190-255 GHz Frequency Quadrupler in SiGe BiCMOS Technology for On-chip Spectroscopic Applications
Jamal, F. I.
Eissa, M. H.
Borngraeber, J.
Ng, H. J.
Kissinger, D.
Wessel, J.
2017 IEEE RADIO AND WIRELESS SYMPOSIUM (RWS), 2017, : 94 - 97
[5] Layout and Interconnect Optimization for Low-Power and High-Sensitivity Operation of E-Band SiGe HBT Frequency Dividers
Dyskin, Aleksey
Harati, Parisa
Kallfass, Ingmar
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2018, 28 (01) : 67 - 69

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