Creep transients during stress changes in ultrafine-grained copper

被引：27

作者：

Kapoor, R ^{[1
]}

Li, YJ

Wang, JT

Blum, W

机构：

[1] Bhabha Atom Res Ctr, Div Mat Sci, Bombay 400085, Maharashtra, India

[2] Univ Erlangen Nurnberg, Inst Werkstoffwissensch LS 1, D-91058 Erlangen, Germany

[3] Nanjing Univ Sci & Technol, Sch Mat Sci & Engn, Xiaolingwei 210094, Peoples R China

来源：

SCRIPTA MATERIALIA | 2006年 / 54卷 / 10期

关键词：

transients; subgrain boundary; ultrafine-grained Cu; equal channel angular pressing (ECAP); severe plastic deformation;

D O I：

10.1016/j.scriptamat.2006.01.032

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Stress change tests were conducted on ultrafine-grained Cu in a region where the grain size is smaller than the steady state subgrain size. After stress reduction the normal creep transients were absent, confirming subgrain strengthening in conventional grain-sized materials and a lack of steady state subgrain structure in the ultrafine-grained materials. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1803 / 1807

页数：5

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