Millimeter wave resonator and cavity-back slot antenna in Fan-Out Wafer Level Packaging

被引：0
|
作者：
Zihao, Chen [1 ]
Guan, Lim Teck [1 ]
机构：
[1] ASTAR, Inst Microelect, 2 Fusionopolis Way,08-02 Innovis Tower, Singapore 138634, Singapore
来源：
2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2018年
关键词：
Fan-out wafer level packaging (FOWLP); millimeter wave; antenna in package;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a 77 GHz reconstitute resonator without TMV is integrated in fan-out wafer level packaging (FOWLP) with mold first process. The resonator is pre-fabricated with a high dielectric constant and low tangent loss dielectric material to achieve small volume and high Q. The side walls of the resonator are plated with copper. The resonator is embedded in the molding compound and RDLs are used to connect the chip and resonator. A Q-factor of 354.4 is achieved. A small form factor and self-shielding cavity-back slot antenna is proposed based on reconstitute resonator. The fractional bandwidth is 1.89% at 79 GHz and the maximal antenna gain is 5 dBi.
引用
收藏
页码：848 / 852
页数：5
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