Phase Equilibria of the Cu-Si-Sn System at 700 and 500 °C

被引：4

作者：

Song, Yuanyuan ^{[1
,2
]}

Su, Xuping ^{[1
,2
]}

Liu, Ya ^{[1
,2
,3
]}

Peng, Haoping ^{[1
,2
]}

Wu, Changjun ^{[1
,2
]}

Wang, Jianhua ^{[1
,2
]}

机构：

[1] Changzhou Univ, Sch Mat Sci & Engn, Changzhou 213164, Peoples R China

[2] Changzhou Univ, Jiangsu Key Lab Mat Surface Sci & Technol, Changzhou 213164, Peoples R China

[3] Changzhou Univ, Jiangsu Collaborat Innovat Ctr Photovolat Sci & E, Changzhou 13164, Jiangsu, Peoples R China

来源：

JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION | 2015年 / 36卷 / 05期

基金：

美国国家科学基金会;

关键词：

Cu-Si-Sn system; intermetallics; phase equilibria Sn-based solder; CU/63SN-37PB SOLDER JOINTS; X-RAY-DIFFRACTION; INTERMETALLIC COMPOUNDS; THERMODYNAMIC CALCULATION; THERMAL FATIGUE; COPPER-SILICON; SUPERSTRUCTURE; INTERFACE; BEHAVIOR; DIAGRAM;

D O I：

10.1007/s11669-015-0405-3

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Intermetallic compounds formed in solder joints have a substantial effect on reliability. Because Sn-based alloys are alternatives to lead-containing solders, phase equilibria of the Cu-Si-Sn system were investigated for quenched samples annealed at 700 and 500 A degrees C for 30 days. Nine three-phase equilibria were well established at 700 A degrees C, and a previously unknown ternary tau phase with a possible homogeneity interval in the range Cu76Sn7.8Si16.2-Cu85Sn7.6Si7.4 was found for the first time. The tau phase has a hexagonal structure with a = 8.012 nm and c = 5.04 nm. Six three-phase regions were identified in the isothermal region at 500 A degrees C. In contrast with the isothermal region at 700 A degrees C, the new ternary tau phase was not observed at 500 A degrees C. The solubility of Si in epsilon-Cu3Sn decreases from 12.8 to 1.4 at.%, and only small variations occur in the homogeneity ranges of eta-Cu3Si and gamma-Cu5Si.

引用

页码：493 / 502

页数：10

共 38 条

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