Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

被引：78

作者：

Sparks, D ^{[1
]}

Queen, G ^{[1
]}

Weston, R ^{[1
]}

Woodward, G ^{[1
]}

Putty, M ^{[1
]}

Jordan, L ^{[1
]}

Zarabadi, S ^{[1
]}

Jayakar, K ^{[1
]}

机构：

[1] Delphi Automot Syst, Kokomo, IN 46904 USA

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2001年 / 11卷 / 06期

关键词：

D O I：

10.1088/0960-1317/11/6/303

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The fabrication and reliability of a solder wafer-to-wafer bonding process is discussed. Using a solder reflow process allows vacuum packaging to be accomplished with unplanarized complementary metal-oxide semiconductor (CMOS) surface topography. This capability enables standard CMOS processes, and integrated microelectromechanical systems devices to be packaged at the chip-level. Alloy variations give this process the ability to bond at lower temperatures than most alternatives. Factors affecting hermeticity, shorts, Q values, shifting cavity pressure, wafer saw cleanliness and corrosion resistance will be covered.

引用

页码：630 / 634

页数：5

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