Dynamic delamination of patterned thin films

被引：17

作者：

Kandula, Soma S. V. ^{[1
]}

Tran, Phuong

Geubelle, Philippe H.

Sottos, Nancy R. ^{[1
]}

机构：

[1] Univ Illinois, Beckman Inst, Urbana, IL 61801 USA

来源：

APPLIED PHYSICS LETTERS | 2008年 / 93卷 / 26期

基金：

美国国家科学基金会;

关键词：

adhesion; aluminium; cracks; delamination; metallic thin films;

D O I：

10.1063/1.3056639

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We investigate laser-induced dynamic delamination of a patterned thin film on a substrate. Controlled delamination results from our insertion of a weak adhesion region beneath the film. The inertial forces acting on the weakly bonded portion of the film lead to stable propagation of a crack along the film/substrate interface. Through a simple energy balance, we extract the critical energy for interfacial failure, a quantity that is difficult and sometimes impossible to characterize by more conventional methods for many thin film/substrate combinations.

引用

页数：3

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