Chip-scale packaging of a gyroscope using wafer bonding

被引：0

作者：

Sparks, D ^{[1
]}

Slaughter, D ^{[1
]}

Beni, R ^{[1
]}

Jordan, L ^{[1
]}

Chia, M ^{[1
]}

Rich, D ^{[1
]}

Johnson, J ^{[1
]}

Vas, T ^{[1
]}

机构：

[1] Delphi Delco Elect Syst, Kokomo, IN 46904 USA

来源：

SENSORS AND MATERIALS | 1999年 / 11卷 / 04期

关键词：

micromachine; gyroscope; wafer bonding; angular rate sensor; electroforming;

D O I：

暂无

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

The chip-scale packaging of a micromachined gyroscope is discussed. The angular rate sensor requires the micropackaging of a resonating element in a vacuum. To fabricate and package the angular rate sensor, Lithographie Galvanoformung Abformung (LIGA)-like electroformed micromachining is integrated onto a complementary metal oxide semiconductor (CMOS) slice, which is wafer-bonded to a silicon micromachined capping slice. Reliability issues and applications of these devices are discussed.

引用

页码：197 / 207

页数：11

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